Icenowy Zheng 330d5fd5be gd32: add new chip series f1x0
GD32F1X0 (X can be 3, 5, 7 and 9) is a series of Cortex-M3 MCUs by
GigaDevice, which features pin-to-pin package compatibility with
STM32F030 MCU line. F150 adds USB support to F130, and F170/F190 adds
CAN support.

Currently the code mainly targets GD32F130 and F150 chips. Some register
are different between F130/150 and F170/190, just like the difference
between STM32F1 Performance line and Connectivity line.

From the perspective of registers and memory map, GD32F1X0 seems like a
mixture between STM32F1 and STM32F0 (because it is designed to be
pin-to-pin compatible with F0, but with Cortex-M3 like F1). A bunch of
code are shared between STM32 and GD32, and these code are specially
processed to include the GD32 headers instead of STM32 headers when meet
GD32F1X0.

Signed-off-by: Icenowy Zheng <icenowy@aosc.io>

Reviewed-by: Karl Palsson <karlp@tweak.net.au>
gd32/rcc.[ch] are forks of stm32f1/rcc
gd32/flash.[ch] are forks of stm32f0/flash
No attempts at deduplicating this have been done at this stage.  We can
see where they move in the future.
2019-04-03 12:53:33 +00:00

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{
"irqs": [
"wwdg",
"pvd",
"rtc",
"flash",
"rcc",
"exti0_1",
"exti2_3",
"exti4_15",
"tsc",
"dma_channel1",
"dma_channel2_3",
"dma_channel4_5",
"adc_comp",
"tim1_brk_up_trg_com",
"tim1_cc",
"tim2",
"tim3",
"tim6_dac",
"reserved0",
"tim14",
"tim15",
"tim16",
"tim17",
"i2c1_ev",
"i2c2_ev",
"spi1",
"spi2",
"usart1",
"usart2",
"reserved1",
"cec_can",
"reserved2",
"i2c1_er",
"reserved3",
"i2c2_er",
"i2c3_ev",
"i2c3_er",
"usb_lp",
"usb_hp",
"reserved4",
"reserved5",
"reserved6",
"usb_wakeup",
"reserved7",
"reserved8",
"reserved9",
"reserved10",
"reserved11",
"dma_channel6_7",
"reserved12",
"reserved13",
"spi3"
],
"partname_humanreadable": "GD32F1x0 Series",
"partname_doxygen": "GD32F1x0",
"includeguard": "LIBOPENCM3_GD32F1X0_NVIC_H"
}