This converts all the YAML files to JSON files, as json parsing is built
into python instead of being a separate library requiring installation.
YAML is a superset of JSON, but putting comments in is not quite as obvious
as it is in yaml.
The following glue was used to convert yaml to json:
python -c 'import sys, yaml, json; json.dump(yaml.load(sys.stdin), sys.stdout, indent=4)' < $1 > $2
Clearly I haven't tested this on every single platform, and this
doesn't address the large blobs of yaml in the lpc4300 scripts directory,
only the cortex NVIC generation process.
I've tested a few IRQ driven example apps, and I've checked the generated
output of some known cases like the LM3s that has explicit gaps, and they are
all generated correctly.
Add memorymap entries for ST calibration data, the vref internal, and the temp
sensor at 30C and 110C for the parts that provide this data.
F1 and F2 do not appear to have this anywhere.
According to RM0090, page 301, paragraph 11.13.12 Note. (For F4, for F1 and F3 is it in the corresponding manuals)
The JSQR are filled always ending at SQR4 ie for those lists we must set this list:
(A) -> JSQ4 = A,
(A,B) -> JSQ3 = A, JSQ4 = B,
(A,B,C) -> JSQ2 = A, JSQ3 = B, JSQ4 = C,
(A,B,C,D) -> JSQ1 = A, JSQ2 = B, JSQ3 = C, JSQ4 = D,
The readed values are in correct order, starting from JDR1:
(A) -> JDR1 = A,
(A,B) -> JDR1 = A, JDR2 = B,
(A,B,C) -> JDR1 = A, JDR2 = B, JDR3 = C,
(A,B,C,D) -> JDR1 = A, JDR2 = B, JDR3 = C, JDR4 = D,
The common code wasn't being included in L1 builds, even though the headers now
included the correct definitions.
This combines the two f0 and f3 spi files, which previously differed only in
the number of spi peripherals defined.
Files were renamed to the full "l1f124" style, not because I like it, but
because it's the convention we have, so it's best to apply it rigourously.
Tested on L1 and F100 boards, compile tested only for others, but the examples
repository all compiles too. (Though the lack of SPI examples for all
platforms was how this broke in the first place)
STM32L1 has a different set of offsets, not just a different base
address, so we can't have common registers definitions. Also, out of
F0,F1,F2,F3,F4,L1, only the F1 has the odd note about 2x16bit registers
and 2x32bit registers with one 16bit register marked as "This field
value is also reserved for a future feature." Therefore, replace the
awkward reading out as multiple words and just copy them in.
F0,F2,F3,F4 were missing definitions altogether.
This does _not_ attempt to address the problem of the mismatched base
addresses for Medium+ and High Density L1 parts.
- Additional frequency configuration (48Mhz, for usb use!)
- FLASH latency decreased (too unnecessarily low before)
- Rcc functions to change usb freq prescaler.
Very few functions can be shared (~ 3). A possible solutions is to move
i2c_common_all to i2c_common_f124, create i2c_common_all and move f3/i2c to i2c_common_f3. Who agrees?
- Makefiles of other stm32s updated accordingly.
- f3/rcc.c updated to some definition changes.
- f3/flash.c removed in order to use flash_common_f234.c to comply with new organization.
